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BKRtechnolgy, The Best Choice for Printed Circuited Boards
Copyright 2002-2007 BKRtechnolgoy Com Ltd. All Rights Reserved.
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This is an example of flex used in a rigid
application; four layer board with .006
controlled depth, laser vias, with each part
individually scaled at drilling. Innerlayers
have 2/1.5 spacing.
Application: Carrier for piezo chip
Size: 2.25” by 2.375”
Layers: 4 overall, pure flex
Materials: Adhesiveless flex
Fusible polyimide bond ply
Traces: 2/1.5 innerlayers
4/4 outerlayers
Minimum hole: .006
Minimum pad: .012
Thickness: .016
Other: Controlled depth laser vias
Laser clearing of pads in chip cavity
Rogers R 8080 Photoimagable Coverlay
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4-layer PCB with blind hole for bluetooth
FR4 0.8mm
0.22mm BGA pads
line width / space 3mil (0.075mm)
0.15mm blind hole (laser drill)
surface finishing: OSP+Carbon ink
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Product Sample
