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This is a large board for a medical device that
is eighteen layers and presents difficult
registration due to the number of layers and
board’s dimensions.
Application: Medical Imaging
Size: 4.5” by 22.25”
Layers: 18 overall
Four layers flex with four layers of epoxy
silver shielding
Materials: Adhesiveless flex
Polyimide core
Polyimide no flow prepreg
Traces: 7/4 innerlayers
7/5 outerlayers
Minimum hole: .024
Minimum pad: .040
Thickness: .093 ± .005
Other: Silver epoxy shielding
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This board is for a military avionics
application; it has ten layers with four layers
of flex, 4/4 on innerlayers, with 4/5 on
outerlayers.
Application: Military Avionics
Size: 5.125” by 2.25”
Layers: 10 overall, 4 flex
Materials: Adhesiveless flex
Polyimide core
Polyimide no-flow prepreg
Traces: 4/4 innerlayers
4/5 outerlayers
Minimum hole: .0145
Minimum pad: .025
Thickness: .062 + .007
Other: Selective ENIG and fused solder
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