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This is another pure flex package; 14 layers
bonded with flexible bond plies; controlled
depth laser vias on the outer three layers of
each side.
Application: Infrared Camera
Size: 6.6” by 1.6”
Layers: 14 overall, pure flex
Materials: Adhesiveless flex
Adhesive bond plies and coverlay
Traces: 4/4 innerlayers
4/4 outerlayers
Minimum hole: .006
Minimum pad: .012
Thickness: .060
Other: Controlled depth laser vias
3/8/3 construction
5 Lamination cycles
Silver epoxy shielding
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This board illustrates how designers use flex
to reduce board thickness as well as package
size and weight, and incorporate connectors
into the bare board design.
Application: “Wearable” insulin pump
Size: 3” by 3”
Layers: 6 overall, 2 flex
Materials: Adhesiveless flex
Polyimide core
Polyimide no-flow prepreg
Traces: 4/4 innerlayers
4/4 outerlayers
Minimum hole: .010
Minimum pad: .022
Thickness: .030
Other: ENIG
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