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BKRtechnolgy, The Best Choice for Printed Circuited Boards
Copyright 2002-2007 BKRtechnolgoy Com Ltd. All Rights Reserved.
                 
This is another pure flex package; 14 layers
bonded with flexible bond plies; controlled
depth laser vias on the outer three layers of
each side.
Application: Infrared Camera
Size: 6.6” by 1.6”
Layers: 14 overall, pure flex
Materials: Adhesiveless flex
Adhesive bond plies and coverlay
Traces: 4/4 innerlayers
4/4 outerlayers
Minimum hole: .006
Minimum pad: .012
Thickness: .060
Other: Controlled depth laser vias
3/8/3 construction
5 Lamination cycles
Silver epoxy shielding

This board illustrates how designers use flex
to reduce board thickness as well as package
size and weight, and incorporate connectors
into the bare board design.
Application: “Wearable” insulin pump
Size: 3” by 3”
Layers: 6 overall, 2 flex
Materials: Adhesiveless flex
Polyimide core
Polyimide no-flow prepreg
Traces: 4/4 innerlayers
4/4 outerlayers
Minimum hole: .010
Minimum pad: .022
Thickness: .030
Other: ENIG

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