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BKRtechnolgy, The Best Choice for Printed Circuited Boards
Copyright 2002-2007 BKRtechnolgoy Com Ltd. All Rights Reserved.
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This is a unique board that shows how flex
can be used for high density applications; the
board is 12 layers and thinner than a credit
card. It uses a polyimide cast adhesive so the
package is pure flex.
Application: Engine control unit for robot
Size: 3.75” by 2.875”
Layers: 12 overall, pure flex
Materials: Adhesiveless flex
Fusible polyimide bond ply
Traces: 4.5/4 innerlayers
5/4 outerlayers
Minimum hole: .010
Minimum pad: .018
Thickness: .020
Other: 12 micron copper on innerlayers
Fusible polyimide adhesive
Pure polyimide package
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This board was manufactured for a high
volume telecommunications device, it
features a low cost lay-up with controlled
impedance on three layers.
Application: High volume telecommunications
Size: 1.5” by 0.5”
Layers: 6 overall, 2 flex
Materials: Adhesiveless flex
Epoxy no-flow prepreg
Traces: 4/6 innerlayers
8/6 outerlayers
Minimum hole: .0135
Minimum pad: .027
Thickness: .039 + .005
Other: Controlled impedance on 3 layers
Selective ENIG and fused solder
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Product Sample
