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BKRtechnolgy, The Best Choice for Printed Circuited Boards
Copyright 2002-2007 BKRtechnolgoy Com Ltd. All Rights Reserved.
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This is for connection in a research unit
Customer in Europe
Size:15.7" by 0.19"
Layer:4 layers
Thickness: 8 mil inch
Material:polyimide
Surface finish:ENIG
Copper thickness: 0.3 OZ inner, 0.5 OZ outside layers
Coverlayer: 0.5 mil inch polyimide
Base: 0.5 OZ double side adhesive - less rolled copper
Other feature: 0.1mm laser via; minimum trace - gap is 2 mil inch;it has reach etching limit capability in most circuit house; no stiffener
This is used in a geologic research machine
Customer in US
Layers: 4 layer
Size: 7" by 2.4"
Surface finish: HAL lead free
Copper: 2 OZ all layers, 0.001" inside wall of holes;
Solder mask: Taiyo high temp model, double coated
Material: polyimide that meet IPC-4101/41, Tg about 250 C, the board is suitable for operation in high temperature environment;