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BKRtechnolgy, The Best Choice for Printed Circuited Boards
Copyright 2002-2007 BKRtechnolgoy Com Ltd. All Rights Reserved.
Manufacturing Capability
Category
|
Standard
|
Special
|
Board Thickness
|
||
Minimum
|
0.008"
|
0.006"
|
Maximum
|
0.200"
|
0.260"
|
Panel / Board Dimensions
|
||
Minimum Panel Dimensions
|
0.2" x 0.4"
|
|
Maximum Panel Dimensions
|
21" x 24"
|
24" x 32"
|
Maximum Board Dimensions
|
21" x 24"
|
24" x 32"
|
Minimum Lines & Spaces
|
||
Lines - Internal (0.5oz based copper thickness)
|
0.004"
|
0.003"
|
Lines - External (0.5oz based copper thickness)
|
0.004"
|
0.003"
|
Spaces - Internal (0.5oz based copper thickness)
|
0.004"
|
0.003"
|
Spaces - External (0.5oz based copper thickness)
|
0.004"
|
0.003"
|
Layer Count
|
||
Maximum Layer Count - rigid
|
28
|
40
|
Maximum Layer Count - multi-flex
|
10
|
12
|
Maximum Layer Count - rigid/ flex
|
24*
|
28*
|
* Structure related
|
||
Based Copper Thickness Capability
|
||
0.25 oz
|
Yes
|
Yes
|
0.5 oz
|
Yes
|
Yes
|
1.0 oz
|
Yes
|
Yes
|
2.0 oz
|
Yes
|
Yes
|
3.0 oz
|
Yes
|
Yes
|
4.0 oz
|
Yes
|
Up to 6.0 oz
|
Annular Ring (pad to drill difference)
|
||
Internal Layers
|
0.01"
|
0.008"
|
External Layers
|
0.001"
|
0.008"
|
Minimum Hole to Line
|
0.001"
|
0.007"
|
Drilling Capability
|
||
Minimum Drilled Hole
|
0.008"
|
0.004"
|
Hole Location Accuracy
|
0.0008"
|
0.0008"
|
Image to Hole Location Accuracy
|
0.004"
|
0.004"
|
Aspect Ratio
|
1:8
|
1:12
|
Micro-via Drilling Aspect Ratio
|
1:1
|
1:1
|
Micro-via Drilling Diameter
|
0.004"
|
0.003"
|
Micro-via Stop Pad Diameter
|
0.012"
|
0.010"
|
Dielectric Thickness of Micro-via Layer
|
0.002"
|
0.004"
|
Solder Mask
|
||
Minimum Solder Mask Clearance SMD Pads
|
0.0015"
|
0.0015"
|
Minimum Solder Mask Dam Between SMD Pads
|
0.005"
|
0.005"
|
Minimum Solder Mask Thickness
|
12μm
|
10μm
|
Plating Capability
|
||
Average Copper Plating
|
1oz
|
1oz
|
Minimum Copper Plating
|
0.5oz
|
0.5oz
|
Minimum Tin/Lead as Plated (if applicable)
|
7μm
|
7μm
|
Nickel Thickness
|
2.5μm - 12μm
|
2.5μm - 12μm
|
Gold Edge Connector Thickness
|
0.8μm - 1.2μm
|
0.8μm - 1.2μm
|
Selective Electrolytic Gold Plating
|
0.8μm - 2.0μm
|
0.8μm - 2.0μm
|
OSP Thickness
|
0.2μm - 0.35μm
|
0.2μm - 0.35μm
|
HAL Thickness
|
1μm - 15μm
|
1μm - 15μm
|
Immersion Gold Thickness
|
0.05μm - 0.1μm
|
0.05μm - 0.1μm
|
Immersion Tin Thickness
|
1μm
|
1μm
|
Immersion Silver
|
0.2μm
|
0.2μm
|
Machining
|
||
Routing Tolerance
|
+/-0.008"
|
+/-0.004"
|
Hole to Edge Location
|
+/-0.004"
|
+/-0.002"
|
V-Groove Angles Capability (degree)
|
20 - 30 -45
|
20 - 30 -45
|
Electrical Test
|
||
Single Ended Impedance
|
Yes
|
Yes
|
Differential Impedance
|
Yes
|
Yes
|
Test Voltage
|
0.5 - 500V
|
|
Max Isolation Resistance
|
500M ohm
|
|
Min Continuity Resistance
|
1 ohm
|
